- Usage：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | 1 |
20,888
In-stock
|
Get Quote | |||
|
|
Laird Technologies - Thermal Materials | 1 |
49,190
In-stock
|
Get Quote |
